Next-generation cars are rumored to use MediaTek 3nm silicon thanks to the Dimensity Auto platform

Photo Credit: TechArea 24-Mobile Phones And Gadgets Review MediaTek has announced that a new variety of computing solutions for next-generation automobiles have been added to its renowned Dimensity line of mobile SoCs. It rather directly competes with Qualcomm's most recent products for the same market, claiming to meet the demands of the "smart cockpit" and connectivity on the road as well as automatic driver assistance systems (ADAS), offered through the OEM's cutting-edge architecture. MediaTek has launched a machine learning/vision capable "scalable...multi-processor" platform for next-generation cars as a response to its understanding that "the era of intelligent, always-connected vehicles has arrived." This platform was created to bring the Dimensity brand to the automotive industry. Photo Credit: The Tech Outlook In addition, it includes several "HDR-native" cameras and MiraVision technology, which is capable of putting up to 8K/120Hz HDR panels in a car. The new Dimensity Auto Cockpit system, which openly contends with Qualcomm's most recent Snapdragon Ride analog for the title of "world's fastest smart cockpit," includes that possibility. To do this, it is built on a 3nm technology rather than a 4nm process as in Qualcomm's case. Dimensity Auto Connect, which once again directly targets the Snapdragon Auto 5G Modem-RF Gen 2 and supports Wi-Fi 7, GNSS, sub-6GHz 5G, Bluetooth, and MediaTek's 5G NTN technology for satellite communication, might be installed alongside it. In order to utilize the capabilities of MediaTek's APUs for AI-enhanced ADAS, Dimensity Auto Drive has also been introduced. Last but not least, MediaTek promises automakers that it won't abandon peripherals with a "diverse" range of Dimensity Auto Components like "assured...PMIC solutions", integrated display support that may include the use of flexible OLED, and positioning systems that are said to continue working even when satellites are out of range. Also Read: TSMC is preparing to manufacture Apple’s 3nm chips, which are expected in 2023 In fact, the new platform appears to be able to make a car as intelligent as a cutting-edge mobile device; there is even a "dedicated DSP for microphone audio". When the first Dimensity Auto-powered vehicle will be on the road has not yet been determined by MediaTek.